IPC-A-610 FINNISH Revision D, February 1, 2005 Acceptability of Electronic Assemblies
J-STD-001 ITALIAN Revision F, February 1, 2005 Requirements for Soldered Electrical and Electronic Assemblies
IPC-2546 2003 Edition, January 2003 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly
IPC-1066 2005 Edition, January 1, 2005 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices
IPC-1065 2005 Edition, January 1, 2005 Material Declaration Handbook
IPC-9194 2004 Edition, September 1, 2004 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
IPC-6012 SWEDISH Revision B, August 1, 2004 Qualification and Performance Specification for Rigid Printed Boards
IPC-6012 ITALIAN Revision B, August 1, 2004 Qualification and Performance Specification for Rigid Printed Boards
IPC-A-600 ITALIAN Revision G, July 1, 2004 Acceptability of Printed Boards
IPC-1720 CHINESE Revision A, July 1, 2004 Assembly Qualification Profile
IPC-TM-650 2.1 Revision K, June 1, 2004 Visual Test Methods
IPC/JEDEC-9702 2004 Edition, June 2004 Monotonic Bend Characterization of Board-Level Interconnects