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IPC-1066
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IPC-1066 2005 Edition, January 1, 2005 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices
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Description / Abstract:
This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.
This standard shall apply to all electronic components including passives, connectors, solid-state components and other devices that use solder to attach the device/ component to the board or assembly.
This standard shall not apply to:
• Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
• Lead in electronic ceramic parts (e.g., piezoelectronic devices).
This standard shall apply to all electronic components including passives, connectors, solid-state components and other devices that use solder to attach the device/ component to the board or assembly.
This standard shall not apply to:
• Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
• Lead in electronic ceramic parts (e.g., piezoelectronic devices).