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IPC/JEDEC-9702
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IPC/JEDEC-9702 2004 Edition, June 2004 Monotonic Bend Characterization of Board-Level Interconnects
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Description / Abstract:
This publication specifies a common method of establishing the
fracture resistance of board-level device interconnects to flexural
loading during non-cyclic board assembly and test operations.
Monotonic bend test qualification pass/fail requirements are
typically specific to each device application and are outside the
scope of this document.