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API RP 13C:2014 Recommended Practice...
API TR 756-1:2014 Process Plant Tent...
IPC-JP002 2006 Edition, March 1, 2006 Current Tin Whiskers Theory and Mitigation Practices Guideline
IPC-9701 Revision A, February 1, 2006 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC-9701 CHINESE Revision A, February 1, 2006 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC-HDBK-005 2006 Edition, January 1, 2006 Guide to Solder Paste Assessment
J-STD-006 JAPANESE Revision B, January 1, 2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-006 RUSSIAN Revision B, January 1, 2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-8497-1 2005 Edition, December 1, 2005 Cleaning Methods and Contamination Assessment for Optical Assembly
IPC-WP-008 2005 Edition, December 1, 2005 Setting Up Ion Chromatography Capability
JEDEC J-STD-033 DE Revision B, October 1, 2005 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
JEDEC J-STD-033 IT Revision B, October 1, 2005 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
JEDEC J-STD-033 CH Revision B, October 1, 2005 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
JEDEC J-STD-033 RU Revision B, October 1, 2005 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices