IPC-DW-426 1987 Edition, December 1, 1987 Specifications for Assembly of Discrete Wiring
IPC-TM-650 2.4.1.2 1987 Edition, December 1, 1987 Adhesion of Conductors on Hybrid Substrates
IPC-TM-650 2.5.5.3 Revision C, December 1, 1987 Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)
IPC-S-815 Revision B, December 1, 1987 General Requirements for Soldering Electronic Interconnections
IPC-TR-462 1987 Edition, October 1, 1987 Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
IPC-RF-245 1987 Edition, April 1, 1987 Performance Specification for Rigid-Flex Printed Boards
IPC-D-354 1987 Edition, February 1, 1987 Library Format Description for Printed Boards in Digital Form
IPC-AI-640 1987 Edition, January 1, 1987 User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates
IPC-DW-425 Revision A, May 1, 1990 Design and End Product Requirements for Discrete Wiring Boards
IPC-L-115 Revision B, April 1, 1990 Specification for Rigid Metal Clad Base Materials for Printed Boards
IPC-SM-839 1990 Edition, April 1, 1990 Pre and Post Solder Mask Application Cleaning Guidelines
IPC-TA-722 1990 Edition, January 1, 1990 Technology Assessment of Soldering