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IPC-TR-462
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IPC-TR-462 1987 Edition, October 1, 1987 Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
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Description / Abstract:
The Round Robin Test Program had the following objectives.
Determine the effectiveness of different protective coatings, and
methods of coating application, on printed wiring boards. Coatings
were to be applied over a variety of conductor patterns, land
configurations, plated and nonplated holes, on PWBs with and
without solder mask. Provide insight into PWB solderability after
various time periods in typical storage conditions, and correlate
this data with the thickness and characteristics of the coating.
Determine if various patterns of conductors, lands, spacing and
configuration contributed to the soldering characteristics.