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IPC-S-815
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IPC-S-815 Revision B, December 1, 1987 General Requirements for Soldering Electronic Interconnections
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Description / Abstract:
This standard prescribes general requirements for
highquality soldering of electronic interconnections.
(Processes are restricted to those soldering alloys having liquidus
temperatures below 427°C [800°F].)
Purpose. This standard defmes the approved materials, methods, and inspection criteria for producing the quality of electrical soldering workmanship necessary for soldering of electrical connections and printed board assemblies. (It is not the intent of this standard to exclude any acceptable procedure for applying flux and solder m making soldered electrical connections, however, the methods used must produce completed solder joints equivalent to the acceptable joints described in this standard.)
The requirements for soldering and solder connections are defined in general terms. Where specific, more stringent applications are necessary, the requirements shall be defined as additional restrictions on the general solder connection requirements.
Purpose. This standard defmes the approved materials, methods, and inspection criteria for producing the quality of electrical soldering workmanship necessary for soldering of electrical connections and printed board assemblies. (It is not the intent of this standard to exclude any acceptable procedure for applying flux and solder m making soldered electrical connections, however, the methods used must produce completed solder joints equivalent to the acceptable joints described in this standard.)
The requirements for soldering and solder connections are defined in general terms. Where specific, more stringent applications are necessary, the requirements shall be defined as additional restrictions on the general solder connection requirements.