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IPC-9701
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IPC-9701 Revision A, February 1, 2006 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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Description / Abstract:
This specification establishes specific test methods to evaluate
the performance and reliability of surface mount solder attachments
of electronic assemblies. It further establishes different levels
of performance and reliability of the solder attachments of surface
mount devices to rigid, flexible and rigid-flex circuit structures.
In addition, it provides an approximate means of relating the
results from these performance tests to the reliability of solder
attachments for the use environments and conditions of electronic
assemblies.
Purpose The purpose of this document is:
• To provide confidence that the design and the manufacturing/assembly processes create a product that is capable of meeting its intended goals.
• To permit the analytical prediction of reliability based on a generic database and technical understanding.
• To provide standardized test methods and reporting procedures.
Purpose The purpose of this document is:
• To provide confidence that the design and the manufacturing/assembly processes create a product that is capable of meeting its intended goals.
• To permit the analytical prediction of reliability based on a generic database and technical understanding.
• To provide standardized test methods and reporting procedures.