IPC-4781 2008 Edition, May 1, 2008 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks
IPC-4811 2008 Edition, April 1, 2008 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
IPC-4562 Revision A, April 2008 Metal Foil for Printed Board Applications
JEDEC J-STD-020 RUSSIAN Revision D.1, March 1, 2008 Moisture/Reflow Sendistivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-020 CHINESE Revision D, March 1, 2008 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC-TM-650 2.5 Revision X, December 1, 2007 Electrical Test Methods
IPC-TM-650 2.3 Revision Y, December 1, 2007 Chemical Test Methods
IPC-7711/7721 CD Revision B, November 1, 2007 REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC-7711/7721 FRENCH Revision B, November 1, 2007 REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC-7711/7721 KOREAN Revision B, November 1, 2007 REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC-7711/7721 CZECH Revision B, November 1, 2007 REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC-4563 2007 Edition, November 1, 2007 Resin Coated Copper Foil for Printed Boards Guideline