Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
New
Reduced price!
View larger
View larger
IPC-4563
New product
IPC-4563 2007 Edition, November 1, 2007 Resin Coated Copper Foil for Printed Boards Guideline
More info
Description / Abstract:
This guideline covers the requirements for resin coated copper
foil intended for use in the formation of high density interconnect
surface microvias for printed boards and printed board
assemblies.