IPC-4553 CHINESE Revision A, May 1, 2009 SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC-4553 Revision A, May 1, 2009 Specification for Immersion Silver Plating for Printed Boards
IPC-TM-650 2.5.5.11 2009 Edition, April 1, 2009 Propagation Delay of Lines on Printed Boards by TDR
IPC/JEDEC-9703 2009 Edition, March 1, 2009 Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-6017 2009 Edition, March 1, 2009 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC-WP-009 2009 Edition, March 1, 2009 A Summary of Tin Whisker Research References
IPC-TR-586 2009 Edition, March 1, 2009 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-6013 CHINESE Revision B, January 1, 2009 Qualification and Performance Specification for Flexible Printed Boards
IPC-6013 GERMAN Revision B, January 1, 2009 Qualification and Performance Specification for Flexible Printed Boards
J-STD-004 Revision B, December 2008 Requirements for Soldering Fluxes
J-STD-004 CHINESE Revision B, December 2008 Requirements for Soldering Fluxes
IPC-9252 CHINESE Revision A, November 1, 2008 Requirements for Electrical Testing of Unpopulated Printed Boards