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IPC-6017
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IPC-6017 2009 Edition, March 1, 2009 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
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Description / Abstract:
Statement of Scope This specification covers qualification and
performance of in-process and finished printed boards (PBs)
containing embedded passive circuitry with distributive capacitive
planes, capacitive or resistive components.
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).