J-STD-027 2003 Edition, February 1, 2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC-TM-650 1.0D Revision D, January 1, 2003 Section One - Table of Contents
IPC-D-356 Revision B, October 1, 2002 Bare Substrate Electrical Test Data Format
IPC-4552 GERMAN 2002 Edition, October 1, 2002 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC-9199 2002 Edition, September 1, 2002 Statistical Process Control (SPC) Quality Rating
IPC-CC-830 CHINESE Revision B, August 1, 2002 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-CC-830 Revision B, October 2008 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-2252 2002 Edition, July 1, 2002 Design Guide for RF/Microwave Circuit Boards
IPC-TR-583 2002 Edition, July 1, 2002 An In-Depth Look At Ionic Cleanliness Testing
IPC-9850 KIT 2002 Edition, July 1, 2002 Test Materials Kit for Surface Mount Placement Equipment Standardization - components negative image - WITHOUT white backgrounds
IPC-DRM-56 2002 Edition, July 1, 2002 Wire Preparation and Crimping Desk Reference Manual
J-STD-032 2002 Edition, June 1, 2002 Performance Standard for Ball Grid Array Balls