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J-STD-027
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J-STD-027 2003 Edition, February 1, 2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
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Description / Abstract:
This standard establishes mechanical outline requirements for
devices supplied in flip chip or Chip Size Package (CSP) formats,
including die surface, die terminals, and interconnection
balls/bumps/lands to the next level.
Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.
Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.