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IPC-7095 CHINESE Revision C, January 1, 2013 Design and Assembly Process Implementation for BGAs
IPC-HDBK-850 2012 Edition, July 1, 2012 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
IPC-7527 GERMAN 2012 Edition, May 1, 2012 Requirements for Solder Paste Printing
IPC-TM-650-MDP 2012 Edition, May 1, 2012 IPC Test Method Development Packet
IPC-7527 DANISH 2012 Edition, May 1, 2012 Requirements for Solder Paste Printing
IPC-9151 Revision D, May 1, 2012 Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database
IPC-7527 2012 Edition, May 1, 2012 Requirements for Solder Paste Printing
IPC-1758 2012 Edition, May 1, 2012 Declaration Requirements for Shipping, Pack and Packing Materials
IPC-9203 2012 Edition, May 1, 2012 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
J-STD-033 HUNGARIAN Revision C, February 1, 2012 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-033 GERMAN Revision C, February 1, 2012 Solderability Tests for Printed Boards
J-STD-005 CHINESE Revision A, February 1, 2012 Requirements for Soldering Pastes