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IPC-7527
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IPC-7527 2012 Edition, May 1, 2012 Requirements for Solder Paste Printing
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Description / Abstract:
This standard is a collection of visual quality acceptability
criteria for solder paste printing.
Purpose
The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing possible.
The purpose of this guideline is not to inspect and evaluate the quality of the solder paste. For information on the evaluation of solder paste, see J-STD-005, Requirements for Soldering Pastes and IPC-HDBK-005.
The purpose is not to define requirements to stencil design. For information on stencil design, see IPC-7525, Stencil Design Guideline.
Appendix A provides different error types and suggested solutions are listed. The guideline is intended to help/ improve the optimizing process for paste printing.
In the case of a discrepancy, the description or written criteria always takes precedence over the illustrations.
Purpose
The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing possible.
The purpose of this guideline is not to inspect and evaluate the quality of the solder paste. For information on the evaluation of solder paste, see J-STD-005, Requirements for Soldering Pastes and IPC-HDBK-005.
The purpose is not to define requirements to stencil design. For information on stencil design, see IPC-7525, Stencil Design Guideline.
Appendix A provides different error types and suggested solutions are listed. The guideline is intended to help/ improve the optimizing process for paste printing.
In the case of a discrepancy, the description or written criteria always takes precedence over the illustrations.