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Description / Abstract:
Objectives and Scope
The Metalic foil Subcommitee of the Base Material Committee
(formerly the Copper Foil Subcommittee of the Raw Materials
Committee) decided in August 1982 to undertake a round robin test
program on copper foil ductility. The objectives of this Round
Robin Study were set by the Subcommittee to be:
(1) the determination of typical ductility values for the
various types and classes of copper foil from different foil
manufacturers;
(2) the establishment of minimum ductility requirements for the
IPC-CF-150, Copper Foil for Printed Wiring
Applications1
(3) the round robin testing of the fatigue ductility test method
for metallic foils2 to
(a) determine critical and sensitive test method steps,and
(b) if necessary, generate the information to emphasize and
elucidate any critical test method steps,
(4) the establishment of the extent to which the relationship
underlying the fatigue ductility test method can be utilized to
predict the high-cycle fatigue behaviour of metallic foils,and
(5) the determination of the bending fatigue behaviour of the
copper foils