Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
New
Reduced price!
View larger
View larger
IPC-9502
New product
IPC-9502 1999 Edition, April 1, 1999 PWB Assembly Soldering Process Guideline for Electronic Components
More info
Description / Abstract:
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged.
This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.
Note: This document does not address the increased temperature requirements of lead-free solders.
This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.
Note: This document does not address the increased temperature requirements of lead-free solders.