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IPC/JPCA-6801
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IPC/JPCA-6801 January 1, 2000 Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
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Description / Abstract:
This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred to herein, is defined as the printed board that is built up progressively with the conductor layers and insulating layers using techniques such as plating and printing. The build-up/HDI PWBs include substrates for semiconductor packages.