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IPC-TR-486
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IPC-TR-486 2001 Edition, July 1, 2001 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations
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Description / Abstract:
The scope of this test program includes a study of the
repeatability and reproducibility of IST and thermal stress test
method to determine the presence of inner-layer separations,
development of guidelines for the use of IST testing and test data
as a substitute for thermal stress testing in acceptance of product
for shipment and to generate a report assessing all pertinent
criteria of the program purpose.