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IPC-0040
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IPC-0040 2003 Edition, May 1, 2003 Optoelectronics Assembly and Packaging Technology
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Description / Abstract:
This document addresses the implementation of optical and optoelectronic packaging technologies.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.
Purpose
This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.
Purpose
This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.