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IPC-TM-650 2.6.7.2B
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IPC-TM-650 2.6.7.2B 2004 Edition, May 1, 2004 Thermal Shock, Continuity and Microsection, Printed Board
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Description / Abstract:
This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause physical fatigue.