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IPC-7526
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IPC-7526 2007 Edition, February 1, 2007 Stencil and Misprinted Board Cleaning Handbook
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Description / Abstract:
This Handbook addresses the removal of solder paste and
uncured/unreacted SMT adhesives from stencils, misprinted printed
circuit boards (PCBs) and application tools connected to the
soldering paste application processes.
Purpose The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology.
Purpose The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology.