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IPC-TM-650 2.4.28.1
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IPC-TM-650 2.4.28.1 Revision F, March 1, 2007 Solder Mask Adhesion - Tape Test Method
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Description / Abstract:
This test method defines the procedure for determining the
adhesion of solder resists (masks) used over melting metals, (such
as solder plated and reflowed solder printed boards both prior to
and after soldering), nonmelting metals, and printed board
substrates.