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Description / Abstract:
This document summarizes the IPC position on the subject of
‘‘halogen-free'' materials for the electronics industry. Its
initial release was developed over a period of three years and this
revision was also worked upon for another 3 years by a team
representing every level of the electronics supply chain. This
document is applicable to materials for interconnecting electronics
including, but not limited to, copper-clad laminates and prepregs,
resin coated copper foils, flexible materials and solder masks.
This document reflects the state of the information and technology
as of May 2007.