IPC-C-1000

Description / Abstract: IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents. Documents were reviewed and recommended for inclusion by IPC's technical staff.

These IPC documents can be viewed individually through the appropriate IPC subscriptions in IHS Standards Expert.

1071A: Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing

1601: Printed Board Handling and Storage Guidelines

2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

2152: Standard for Determining Current Carrying Capacity in Printed Board Design

2221B: Generic Standard on Printed Board Design

2222A: Sectional Design Standard for Rigid Organic Printed Boards

2223C: Sectional Design Standard for Flexible Printed Boards

2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

2226: Sectional Design Standard for High Density Interconnect (HDI) Boards

2251: Design Guide for the Packaging of High Speed Electronic Circuits

2252: Design Guide for RF/Microwave Circuit Boards

2316: Design Guide for Embedded Passive Device Printed Boards

2611: Generic Requirements for Electronic Product Documentation

2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript

2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

2614: Sectional Requirements for Board Fabrication Documentation

2615: Printed Board Dimensions and Tolerances

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for Anisotropically Conductive Adhesives Films

4101D: Specification for Base Materials for Rigid and Multilayer Printed Boards

4103A-WAM1: Specification for Base Materials for High Speed/High Frequency Applications

4104: Specification for High Density Interconnect (HDI) and Microvia Materials

4110: Specification Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar

4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

4130: Specification Characterization Methods for Nonwoven "E" Glass Mat

4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry

4203A: Cover and Bonding Material for Flexible Printed Circuitry

4204A-WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

4552-WAM1-2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit

4553A: Specification for Immersion Silver Plating for Printed Boards

4554: Specification for Immersion Tin Plating for Printed Circuit Boards

4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating fo

4562A: Metal Foil for Printed Board Applications

4563: Resin Coated Copper Foil for Printed Boards Guideline

4761: Design Guide for Protection of Printed Board Via Structures

4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend

4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed

4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe

5701: Users Guide for Cleanliness of Unpopulated Printed Boards

5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards

5704: Cleanliness Requirements for Unpopulated Printed Boards

6011: Generic Performance Specification for Printed Boards

6012C: Qualification and Performance Specification for Rigid Printed Boards

6013C: Qualification and Performance Specification for Flexible Printed Boards

6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De

6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

7092: Design and Assembly Process Implementation for Embedded Components

7093: Design and Assembly Process Implementation for Bottom Termination Components

7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

7095C: Design and Assembly Process Implementation for BGAs

7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard

7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD

7801: Reflow Oven Process Control Standard

9201A: Surface Insulation Resistance Handbook

9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemic

9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

9252A: Requirements for Electrical Testing of Unpopulated Printed Boards

9641: High Temperature Printed Board Flatness Guideline

9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

9704A: Printed Circuit Assembly Strain Gage Test Guideline

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder

9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering

9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

A-600H: Acceptability of Printed Boards

A-610F: Acceptability of Electronics Assembly

A-620B: Requirements and Acceptance for Cable and Wire Harness Assemblies

C-406: Design Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl

CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

CM-770E: Component Mounting Guidelines for Printed Boards

D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

D-325A: Documentation Requirements for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse

D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

DR-572A: Drilling Guidelines for Printed Boards

FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Pr

HDBK-005: Guide to Solder Paste Assessment

HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, T

J-STD-003C-WAM1: Solderability Tests for Printed Boards

J-STD-004B: Requirements for Soldering Fluxes

J-STD-005A: Requirements for Soldering Pastes

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

J-STD-026: Semiconductor Design Standard for Flip Chip Applications

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030A: Selection and Application of Board Level Underfill Materials

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

MC-790: Guidelines for Multichip Module Technology Utilization

ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print

MS-810: Guidelines for High Volume Microsection

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

S-816: SMT Process Guideline Checklist

SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

SM-780: Component Packaging Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technology Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817A: General Requirements for Dielectric Surface Mount Adhesives

SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology

TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress

TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

TR-583: An In-Depth Look At Ionic Cleanliness Testing

WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin

WP-008: Setting Up Ion Chromatography Capability