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IPC-CH-65

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IPC-CH-65 Revision B, July 1, 2011 Guidelines for Cleaning of Printed Boards and Assemblies

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Description / Abstract: This manual will only include assembly process printed wiring assembly cleaning. The corresponding information on printed wiring board cleaning will be contained in a separate companion document.

Purpose The purpose of this document is to collect and update all the pertinent information on printed wiring assembly (PWA) cleaning in a single, easy to revise/updated document.