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IPC-7525

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IPC-7525 Revision B, October 1, 2011 Stencil Design Guidelines

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Description / Abstract: PURPOSE

This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established.