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Description / Abstract:
Scope/Introduction This Material and Process
Characterization/Qualification Test records changes in Surface
Insulation Resistance (SIR) on a representative sample of a printed
circuit assembly (PCA). It quantifies any deleterious effects that
might arise from solder flux or other process residues left on
external surfaces after soldering, which can cause unwanted
electro-chemical reactions that grossly affect reliability.
It uses test vehicles that are intended to be representative of
the electronic circuits that are in production. It is a test
yielding both quantitative and qualitative data.
This test may be used for Process Qualification,
demonstrating that a proposed manufacturing process or process
change can produce hardware with acceptable end-item performance
related to cleanliness. Changes may involve any assembly process
step, or a change in the printed board supplier, solder mask or
metallization, soldering material supplier, conformal coating, etc.
The test vehicle construction will vary depending upon the type of
change being evaluated.
NOTE: The decision to levy this protocol on
individual manufacturing sites shall be As Agreed
Between User and Supplier (AABUS). See IPC-9203 for further
guidance (As of the publication of this document, IPC-9203 is under
development. Contact the IPC for status and availability). Vehicles
must be prepared at the manufacturer's (User's) location using
production processes and equipment whenever possible. Care must be
taken to ensure that the processed test vehicles are kept free from
any secondary contamination while in transit to the test site.
Testing of the prepared vehicles can be performed by the user or at
a suitable independent laboratory.
There is no single test that can guarantee acceptable
electrochemical performance for all products, applications, and
in-service environments. While there are several methods that may
be used to determine materials and process compatibility, this test
protocol may be used to satisfy electrochemical compatibility.
IPC-J-STD-001 does not require testing to this specific method to
qualify a manufacturing process.
It is strongly recommended that a subset of the unpopulated,
unprocessed coupons be tested for SIR before investing the time and
money to manufacture the test vehicles. If the unprocessed controls
do not return acceptable SIR results because of some undiscovered
fault in the design or construction of the vehicles, the populated
PCAs are likely to fail also.
This test may also be used for Process
Characterizations, including development of new processes or
improvements to an existing process.
This test protocol is specific to the IPC-B-52 standard test
assembly. The use of alternative test vehicles and associated
pass-fail requirements shall be AABUS.
The IPC-B-52 standard test assembly contains both surface mount
and through-hole technologies. Only the applicable portions of the
IPC-B-52 assembly are processed, i.e. only the surface mount
patterns are processed for a surface mount only assembly process;
however, all surface mount patterns must be processed.