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Description / Abstract:
This standard establishes the generic requirements for the
design of organic printed boards and other forms of component
mounting or interconnecting structures, including PC card form
factors. The organic materials may be homogeneous, reinforced, or
used in combination with inorganic materials; the interconnections
may be single, double, or multilayered.
Purpose
The requirements contained herein are intended to establish
design principles and recommendations that shall be used in
conjunction with the detailed requirements of a specific
interconnecting structure sectional standard (see 1.2) to produce
detailed designs intended to mount and connect components. This
standard is not intended for use as a performance specification for
finished printed boards nor as an acceptance document for
electronic assemblies.